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Made in the USA
RIgid Circuits Division

Quality Circuits, Inc. - Technology and Manufacturing Capability

Rigid

Technology

Standard 

Fine 

HDI

Min Spacing Trace to Trace

0.006

0.004

0.0025

Min. Spacing Trace to Pad

0.006

0.004

0.0025

Trace Width

0.006

0.004

0.0025

Finished PCB Thickness +/-

10%

7%

5%

Dimensions - Hole Location

(+/- .003)

(+/- .002)

(+/- .0015)

Dimensions - Fab O.D.

(+/- .005)

(+/- .004)

(+/- .003)

Fabrication Radius ID

0.05

0.031

<.031

Copper To Board Edge

0.007

0.005

<.005

Min. Copper to Score Line

0.02

0.015

0.01

Standard Via Drilled Hole Sizes

Standard 

Fine 

HDI

Finished Hole to Inner Trace or Ground Plane

0.012

0.010

0.008

FR-4 Material .062 Thick

0.018

0.010

0.008

Aspect Ratios

3.5:1

6.0:1

>6.0:1

Outer Layer Pad / Hole Criteria

Standard 

Fine 

HDI

Annular Ring

0.020 pad / 0.010 hole

0.014 pad / 0.006 hole

0.010 pad / 0.004 hole

Soldermask Criteria

Standard 

Fine 

HDI

SMT Web - LPI Mask

0.004

0.003

0.002

LPI Colors

Green, Black, Blue, Red, Amber, Yellow, White

Legend L/W and Height >

.005 x .040

.005 x .040

.005 x .030

Clearance - LPI Mask > or =

.003 / Side

.002 / Side

.0015 / Side

Inner Layer Pad / Hole Criteria

Standard 

Fine 

HDI

Annular Ring

0.022 pad / 0.010 hole

0.016 pad / 0.006 hole

0.012 pad / 0.004 hole

Electrical Characteristics & Testing

* Controlled Impedance +/- 10% to +/- 5%

* Stiff Pin 250 Volt Max.  100 Ohm  9.5" x 14.0 " Grid

 

* Flying Probe 250 Volt Max.  100 Ohm  20" x 27" Capable

 

 

Surface Finishes

* Immersion Silver

* Deep Nickel/Gold

 

 

* OSP

* Soft Gold

 

 

* Hot Air Solder Level

* Carbon Ink

 

 

* Tab Nickel/Gold

* Electroless Nickel/Immer. Gold

 

Materials

Type

TG

TD     

DK @ 1.0 Ghz

FR-4 -02

140 C

320 C.

4.25

FR-4 -06

170 C.

295 C.

4.29

FR-4-08

180 C

360 C.

3.70

FR370HR

180 C

340 C.

4.17

IS-410

180 C.

350 C.

3.90 

G200 (BT) 

185 C

325 C.

3.70

P 95 / P96 (Polyimide)

260 C.

415 C.

3.90

Rogers 3000 / 4000 Series 

 

 

 

 

 

 

 

Software Technologies

* Gerber Data Preferred

* IGI 

* FasTech

 

* E-Mail  and  FTP  Transfer 

* Lavenir

 

 

Board Cleanliness

< 2.0 micro grams Sodium Chloride

* Quarterly Ion Chromatography Testing

 

Quick Turn Capability

* 24 Hour Quick Turn

* Weekend Manufacturing Capability

 

* Standard Production in 5 days

 

 

 

HDI Technology

* Blind Via

* Burried Via

* Via Filling

 

* Sequential Lamination

* Laser Technology