FLEX

Technology

Standard 

Fine 

HDI

Min Spacing Trace to Trace

0.006

0.004

0.0020

Min. Spacing Trace to Pad

0.006

0.004

0.0020

Trace Width

0.006

0.004

0.0020

Finished PCB Thickness +/-

10%

7%

5%

Dimensions - Hole Location

(+/- .003)

(+/- .002)

(+/- .0015)

Dimensions - Fab O.D.

(+/- .005)

(+/- .004)

(+/- .003)

Copper To Board Edge

0.02

0.005

<.005

Standard Via Drilled Hole Sizes

Standard 

Fine 

HDI

As Defined

0.012

0.006

< 0.006

Outer Layer Pad / Hole Criteria

Standard 

Fine 

HDI

Annular Ring

0.016 pad / 0.010 hole

0.012 pad / 0.006 hole

0.008 pad / 0.004 hole

Soldermask Criteria

Standard 

Fine 

HDI

Web - LPI Mask

0.004

0.003

0.0020

LPI Colors

Amber

Legend L/W and Height >

.005 x .040

.005 x .040

.005 x .030

Clearance - LPI Mask > or =

.003 / Side

.002 / Side

.0015 / Side

Inner Layer Pad / Hole Criteria

Standard 

Fine 

HDI

Annular Ring

0.022 pad / 0.010 hole

0.016 pad / 0.006 hole

0.010 pad / 0.004 hole

Electrical Characteristics & Testing

* Controlled Impedance +/- 10% to +/- 7%

*Stiff Pin 250 Volt Max. 100 Ohm 9.5" x 14.0 " Grid

* Flying Probe 250 Volt Max. 100 Ohm 20" x 27" Capable

Surface Finishes

* Immersion Silver

* Tab Nickel / Gold

* Electroless Nickel / Immersion Gold

* OSP

* Deep Nickel / Gold

* Carbon Ink

* Hot Air Solder Level

* Soft Gold

Materials

* Polyimide

* Polyester

Software Technologies

* Gerber Data Preferred

* IGI

* FasTech

* E-Mail and FTP Transfer

* Lavenir

Board Cleanliness

< 2.0 micro grams Sodium Chloride

* Quarterly Ion Chromatography Testing

Quick Turn Capability

* 24 Hour Quick Turn

* Weekend Manufacturing Capability

* Standard Production in 5 days

HDI Technology

* Blind Via

* Burried Via

* Via Filling

* Sequential Lamination

* Laser Technology